Boyd has increased AI data centre liquid cooling system production capacity with the expansion of its manufacturing facility in Bac Ninh, Vietnam.
The increase is in response to growing customer demand. The expansion will bring the Boyd Vietnam campus to approximately 800,000 square feet, up from its current footprint of 400,000 square feet.
Boyd Vietnam features lean, automated manufacturing and assembly processes for high volume production of direct-to-chip liquid cooling loops, in rack manifolds, thermal control units (TCUs), and coolant distribution units (CDUs).
The expansion creates capacity to scale liquid cooled solutions, solving customers’ increasing compute, power, and thermal density demands in rapidly expanding AI data centres.
President of Boyd’s thermal solutions division, David Huang, said the Vietnam facility will provide additional flexibility to meet customer requirements.
“We work diligently to anticipate customer and market needs, continually aligning our company, its supporting footprint, and technology innovation to capture demand,” he said.
The Vietnam facility includes on-site design, testing, process, prototyping, and manufacturing engineering teams to enable highly responsive full product lifecycle and program support, ensuring Boyd can best support customers’ growth plans and accelerated speed to market for high-volume, high-performance AI data centre cooling.