Carrier’s venture group, Carrier Ventures, has expanded its investment in ZutaCore, a provider of direct-to-chip, waterless liquid cooling solutions.
The move strengthens a strategic partnership to support high-density AI data centres and advances Carrier's strategy to deliver integrated solutions across the data centre thermal lifecycle.
It expands its capabilities in advanced liquid cooling technologies, including interoperable single and two-phase cooling systems.
These capabilities further enhance Carrier's broader QuantumLeap suite of thermal and integrated management solutions.
Carrier’s vice president of global data centres, Christian Senu, said AI is fundamentally reshaping data centre architecture, with thermal management emerging as a key constraint to scale.
“This investment strengthens our ability to deliver advanced liquid cooling solutions that help customers scale high-density AI infrastructure efficiently and with improved energy performance for today's chip thermal densities and next-generation architectures,” he said.
The follow-on investment builds on Carrier's 2025 investment in ZutaCore and comes as AI-driven chip power densities continue to rise, increasing demand for advanced cooling solutions, including liquid cooling.
ZutaCore CEO, Erez Freibach, said the expanded partnership with Carrier reflects the need for new approaches to data centre cooling.
"By combining ZutaCore's waterless, direct-to-chip technology with Carrier's system-level expertise, we are enabling the next generation of high-density AI data centres,” he said.
ZutaCore is a California-based provider of direct-to-chip, waterless liquid cooling solutions. Its HyperCool technology uses a closed-loop, two-phase system to remove heat at the source, enabling higher-density AI compute and improved energy efficiency.