Alloy Enterprises, a manufacturing company revolutionising data centre cooling with its novel Stack Forging process, has introduced a new copper direct liquid cooling (DLC) solution.
As chip power densities and thermal design power rise—pushing AI server rack power densities beyond 120 kW—traditional cooling methods are reaching their limits.
With Stack Forging, Alloy delivers superior thermal performance with significant advantages:
- Targeted liquid cooling where heat loads are highest
- Up to 10x reduction in pressure drop, enabling smaller pumps and energy savings
- Single-piece construction that eliminates leak points common in traditional liquid cooling systems
Alloy Enterprises CEO & cofounder, Ali Forsyth, said the company is setting a new standard in direct liquid cooling technology with its proprietary Stack Forging process.
"We now deliver industry-leading thermal performance in both aluminum and copper, enabling higher rack densities, significant cost savings and greater sustainability,” Forsyth said.
“With 600 kW racks on the horizon, the shift to liquid cooling is no longer optional—it's mission-critical."
With the expansion to copper thermal solutions alongside its existing aluminum offerings, Alloy now provides cooling components that meet ASHRAE standards for chemical compatibility while enabling the extreme cooling demands of next-generation high-performance computing and high-density AI workloads.
This breakthrough comes at a pivotal moment for the industry with McKinsey stating that global data centre power demand could triple by 2030.
Meanwhile, rack densities have more than doubled in just two years as AI workloads intensify.
Alloy's Stack Forged DLC components provide the thermal performance needed to meet these escalating demands in thermal design power.
With superior pressure drop reduction, data centers can use 44 °C (111.2°F) water and smaller pumps, eliminating the need for refrigerated HVAC systems.
The result is a reduction in data centre energy consumption by up to 23 per cent, dramatically improving both sustainability and profitability.
For hyperscalers and colocation providers, these efficiency gains translate directly to increased revenue and reduced costs.
More efficient cooling means more AI tokens can be sold with significantly lower energy costs. Additionally, Alloy's thermal solutions help maximize compute density per square foot, improve power usage effectiveness (PUE), and reduce total cost of ownership.
Alloy supports this transformation with a fully sustainable supply chain: 100% of aluminum and copper scrap generated during manufacturing is easily recycled, reinforcing the long-term environmental and economic value of smarter thermal design.
"Alloy's copper line is already showing promising results in early customer deployments," Forsyth said.
"These components are hitting target thermal resistance thresholds while maintaining exceptional pressure drop performance, even in the most demanding rack configurations."