Colder Products Company (CPC), a leading manufacturer of connection technologies used in liquid cooling of electronics, has developed a new solution to address growing liquid cooling needs in artificial intelligence (AI) computing.
The Everis UQD06 Series connectors are designed specifically to handle AI's higher-flow liquid cooling requirements.
The product is the latest in CPC's universal quick disconnect (UQD) line, which is purpose-built for hyperscale AI, data centre and high-performance computing (HPC) applications.
The general manager of CPC’s thermal business unit, Patrick Gerst, said the substantial heat generated by AI workloads requires new ways to optimize flow in liquid cooling systems.
“With the UQD06 Series, CPC is building on our long track record of delivering much-needed solutions for efficient cooling. We remain focused on supporting AI's expansion and unique liquid cooling specifications through innovation at scale,” he said.
While higher flow rates alone can improve cooling, the industry is seeking optimized cooling. "Increased flow often requires higher pumping capabilities, which can affect overall system design and energy efficiency," Gerst said.
"Increasing the connector's flow path size is one way to add flow capacity."
According to Hyperion Research, about two-thirds of HPC/AI sites have implemented some form of liquid cooling, with adoption expected to reach nearly 80 per cent in the next 12-18 months.
Flow rates within systems have also increased. The new Everis UQD06 quick disconnect brings a 3/8-inch flow path to the UQD family, which also includes 1/8-inch and 1/4-inch sizes.
UQD06 connectors, like CPC's full UQD Series, reflect the company's focus on quality, including extensive parts testing, and patented technology for high-flow capacity.
CPC business unit vice president, Michael Studer, said that as a trusted technology partner to leading chip manufacturers and cooling integrators, the company provide solutions that help protect mission-critical applications, particularly as AI continues to rapidly scale.